EHB 427E - Microelectronics Technology

Course Objectives

Teaching the student
1.Properties of the materials used in microelectronic fabrication,
2.Basic process steps in CMOS and SiGe bipolar fabrication,
3.How the electrical properties of the devices are affected at each process step.
4.Scaling in microelectronics and its effects.

Course Description

Brief history of the microelectronics technology. Planar technology. micro-litography. Thin films;
Evaporation, sputtering and CVD techniques. thermal oxidation of silicon. Doping techniques; diffusion,
ion implantation and epitaxy. ın process measurement and evalution techniques. Proess simulation;
SUPREM. Process design: junction isolated bipolar IC and CMOS IC fabrication processes. Packaging.
Yield analysis